DLP / MSLA
Digital Light Processing
DLP and MSLA cure entire resin layers at once with a projector or masked LCD. Build speed is independent of part count per layer — ideal for small precision components and batch runs of detailed parts.
How DLP / MSLA works
- 01
A light engine masks each full layer cross-section.
- 02
The layer cures simultaneously across the build area.
- 03
The platform peels and steps to the next layer.
- 04
Parts are washed and UV post-cured.
Strengths
- Fastest for small batches
- Micro-scale detail
- Excellent surface
- Low cost per small part
Limitations
- Small build envelope
- Resin mechanicals
- UV sensitivity
Design rules for DLP / MSLA
Full guidance in the interactive design guide.
| Minimum wall (unsupported) | 0.5 mm |
| Minimum wall (supported) | 0.3 mm |
| Minimum hole diameter | 0.5 mm |
| Minimum feature size | 0.15 mm |
| Moving-part clearance | 0.25 mm |
| Minimum embossed text | 0.8 mm height, 0.3 mm depth |
| Overhang threshold | Supports auto-generated |
| Max build dimensions | 218 × 123 × 235 mm |
- Whole-layer exposure makes 50 small parts as fast as one.
- Pixel grid (~50 µm) sets the floor for micro-feature fidelity.
- Ideal for form-fit checks of PCB enclosure internals.
Compare with other processes
All technologiesFDM / FFF
Fast, economical thermoplastic parts for prototypes, jigs and fixtures.
± 0.2 mm typical · 350 × 350 × 350 mm
SLA
High-detail resin parts with smooth, injection-molding-like surfaces.
± 0.1 mm typical · 300 × 335 × 200 mm
SLS
Strong, isotropic nylon parts with no supports — built for end use.
± 0.3 mm typical · 330 × 330 × 400 mm