A8 / SENSOR
Challenge
An IoT sensor enclosure had to reconcile RF performance, a compressible environmental gasket, and tool-free field service — three constraints that kept fighting each other in CAD reviews.
Constraints
- Antenna keep-out zones restricted boss and rib placement
- IP54 target with a printed TPU gasket
- Snap-fit service access without visible seams
Engineering approach
Weekly SLA builds in ABS-like resin validated each constraint against physical hardware: RF range walks with the real board, gasket compression measurements, and repeated snap-fit cycling. The TPU gasket was printed in-house alongside each shell revision.
Results
- Tooling released with zero post-release mold changes
- Gasket geometry validated against compression targets before steel
- Field-service snap detail survived cycle testing at revision 4